Rigid flex PCB clone service is a highend professional reverse engineering and board duplication technology for rigidflex combined circuit boards, which integrate rigid PCB parts and flexible PCB parts organically. Rigid flex PCBs combine the high structural stability of rigid boards and the flexible bending characteristics of flexible boards, solving the problems of fixed installation of rigid boards and low structural strength of flexible boards. They are widely used in highprecision electronic equipment such as aerospace instruments, military electronic devices, highend medical equipment, and precision industrial control systems. Due to their composite structure, rigid flex PCB cloning involves dual process standards of rigid and flexible boards, with extremely high technical thresholds for layer alignment, circuit transition, and structural matching.

Our rigid flex PCB clone service follows a fullprocess precise reverse engineering system to ensure the perfect replication of composite circuit boards. First of all, we carry out layered and partitioned precise detection on the original rigid flex board, distinguish the rigid substrate area, flexible substrate area, and rigidflex transition area, and use microscopic scanning and industrial CT detection technology to obtain the inner layer trace distribution, via connection mode, and layered structure parameters of rigid and flexible parts respectively. Different from singletype PCB copying, rigidflex board reverse engineering needs to accurately record the bonding position, transition radian, and reinforcing layer parameters of rigid and flexible splicing parts to avoid structural fracture and circuit disconnection in the cloned board during bending and assembly.

In the file restoration and design optimization stage, our technicians sort out the overall circuit logic of rigid and flexible areas, restore complete PCB layout files, schematic diagrams, and BOM lists, and calibrate the signal transmission matching of rigidflex transition circuits to ensure no signal attenuation or interference during crossarea signal transmission. For the multilayer composite structure of rigid flex boards, we strictly control the layer stacking sequence, copper foil thickness, and insulating layer thickness of rigid and flexible parts, and optimize the via design of transition areas to improve the structural stability and electrical reliability of the board. After the design file is confirmed, we conduct multiphysical field simulation, including bending mechanics simulation and signal transmission simulation, to verify the rationality of the structural design and circuit performance.

The prototype production and testing stage adopts dualstandard verification of rigid board electrical performance and flexible board mechanical performance. We use highquality FR4 rigid substrate and PI flexible substrate consistent with the original board, and adopt professional rigidflex composite pressing technology to ensure the splicing part has high bonding strength and no delamination. Finished products will undergo rigid area hardness testing, insulation performance testing, flexible area bending fatigue testing, and overall circuit continuity and signal stability testing. Our rigid flex PCB clone service can meet the duplication needs of various highprecision composite circuit boards, support smallbatch prototype customization and largescale mass production, and provide reliable technical support for the research and development and maintenance of highend electronic equipment.