Blind and buried hole PCB copy service is a high-difficulty reverse engineering and precise reduction solution for high-precision multi-layer PCBs with blind holes and buried holes, widely used in high-end communication equipment, precision medical devices, industrial control mainboards, and high-density integrated electronic products. Blind holes refer to conductive holes connecting the outer layer and inner layer of the PCB, while buried holes are hidden conductive holes between inner layers, which do not penetrate the entire board. The design of blind and buried holes greatly improves the wiring density and space utilization of multi-layer PCBs, but also brings great challenges to copying work. Traditional cloning technology cannot accurately identify the depth, aperture, and interlayer connection relationship of blind and buried holes, which easily leads to wrong circuit connection data and completely failed board reproduction. Our professional blind and buried hole PCB copy technology adopts layered microscopic scanning and interlayer conduction analysis technology to accurately restore all hidden hole positions and circuit connection relationships.

We implement full-layer precise reduction and interlayer verification for blind and buried hole PCB copying to ensure zero error in circuit conduction and hole position parameters. In the reverse process, we first carry out non-destructive layered detection on the multi-layer PCB with blind and buried holes, record the number of board layers, stacking sequence, and the position, aperture, and depth of each blind hole and buried hole layer by layer, and clarify the one-to-one conduction relationship between holes and inner layer lines. Different from ordinary through-hole PCB copying, we focus on verifying the electrical conductivity and positional accuracy of hidden buried holes, use professional circuit simulation software to perform secondary verification on interlayer conduction data, and eliminate hidden dangers such as virtual connection, wrong connection, and missing connection of inner layer circuits. At the same time, we completely restore the PCB schematic, Gerber layered files, drilling files, and BOM list, and calibrate the impedance parameters and wiring rules of high-density lines to ensure that the signal transmission performance of the reproduced board is consistent with the original board.

Our blind and buried hole PCB copy service covers 4-layer to 32-layer high-precision multi-layer boards, including high-density interconnect (HDI) boards, communication mainboards, and high-speed signal boards with complex blind and buried hole designs. We have broken through the technical difficulties of difficult identification of micro blind and buried holes, complex interlayer connection logic, and easy deviation of high-density wiring reduction. All cloned boards have accurate hole position alignment, smooth interlayer conduction, stable high-speed signal transmission, and fully comply with international HDI board manufacturing standards. After the completion of cloning, we conduct comprehensive tests such as impedance testing, continuity testing, and high-speed signal testing to ensure the stability and reliability of the reproduced products. This service effectively solves the problems of difficult reverse development and high maintenance cost of high-end multi-layer PCBs for enterprises, helps customers quickly complete product replication, equipment maintenance and technical upgrading, and occupies a favorable position in the precision electronic manufacturing market.