PCBA rework management refers to the systematic process of identifying, evaluating, and repairing defective PCBA units to restore their functionality while minimizing additional costs and ensuring product reliability. It starts with a rigorous inspection process, using automated optical inspection (AOI), X-ray inspection, and in-circuit testing (ICT) to detect defects accurately. Once defects are identified, each unit is classified based on defect severity—minor defects that can be easily repaired, major defects requiring component replacement, and irreparable defects that should be scrapped to avoid further resource waste.

A well-structured rework management system includes standardized rework procedures tailored to different types of defects. For instance, solder bridging defects may require desoldering with a soldering iron or hot air station, followed by resoldering to ensure proper connections. Component replacement, such as replacing a faulty integrated circuit (IC), requires precise heating to avoid damaging adjacent components and the PCB substrate. It is essential to document each rework step, including the defect type, repair method used, materials consumed, and the operator responsible, to ensure traceability and accountability.

Quality control during and after rework is a critical aspect of PCBA rework management. After repairing a defective unit, it must undergo a second inspection to verify that the defect has been resolved and no new defects have been introduced during the rework process. Additionally, rework data should be analyzed regularly to identify recurring defects, which can provide insights for process improvements in the production line. Effective rework management not only reduces scrap rates and production costs but also ensures that reworked PCBA units meet the same quality standards as newly produced ones, maintaining customer satisfaction and brand reputation.